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docs/pcb-notes.md
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# RCP-TX7 PCB Notes
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These notes track direct physical observations from inside the Sony RCP-TX7.
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They are intentionally separate from the PT2 protocol notes, because the board
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layout and component choices may explain what the serial experiments alone do
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not.
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## Current Physical Overview
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- The RCP appears to be split into **two circuit boards**.
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- One board looks like a **front-panel / operator interface board**:
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- button matrix
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- lamps / indicators
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- LCD support
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- mostly resistors and small logic
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- many TI `HC595A`-family or similar shift-register-style chips
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- That board connects through an intermediate link to a second board.
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- The second board appears to be the **main logic / controller board**:
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- single-sided
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- carries the main digital devices
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- appears to contain the actual control logic / firmware for the RCP
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## Connector / Wiring Observations
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- The main logic board has an **8-pin connector** associated with the external
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10-pin plug/cable assembly.
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- The **wire colors inside the RCP do not match** the cable color mapping noted
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earlier from the cable itself.
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- This means:
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- internal color cannot be trusted as a one-to-one continuation of external
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cable color
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- the board-side harness should be mapped by continuity, not by color
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## Identified Components
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Observed on the main logic board:
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- `Sanyo LC3564BM-10`
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- `XICOR X20C05J-55 9926`
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- `27C512 RCPTX7 V1.05 SONY98`
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- socketed / clip-retained
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- appears user-replaceable
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- additional marking observed: `0047K`
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- `H8/536 HD`
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- full observed line-by-line marking on the main controller:
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- small logo resembling a target / concentric mark
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- `H8/536`
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- `1B1 A`
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- `HD`
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- `6435368F 16`
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- `W34 JAPAN`
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- several smaller TI logic ICs with varying markings
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## Firmware Cluster Photo Notes
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From the close-up photo of the firmware area:
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- the firmware device is an **ST** `M27C512-10F1` family EPROM/OTP-style part
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carrying the Sony application label:
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- `27C512`
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- `RCPTX7`
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- `V1.05`
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- `©SONY98`
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- the package-side marking also shows:
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- `M27C512`
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- `10F1`
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- `58826`
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- `0047K`
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- `SINGAPORE`
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- the ROM is installed in a **socket**, which strongly supports the idea that
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the firmware can be removed and dumped without desoldering
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- the `XICOR X20C05J-55` sits immediately beside the firmware device
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- the `LC3564BM-10` sits directly above the firmware area
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This creates a very plausible classic memory cluster:
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- EPROM = program storage
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- SRAM = working memory
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- Xicor NVRAM/EEPROM = retained setup/configuration data
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## Silkscreen Clarifications From Photo
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The close-up suggests a couple of earlier markings may need cautious reading:
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- the vertical marking beside the ROM socket still looks like
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`CNI12` / `CN112`-like text and should be rechecked carefully from the board
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itself
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- `RV1` appears near an **unpopulated footprint** below the ROM area
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rather than clearly identifying the ROM itself
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So, for now:
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- treat `RV1` as a likely local board reference near that empty footprint
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- do not treat `RV1` as the firmware module identifier
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## Additional Photo-Backed Board Observations
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From the newer board photos:
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### Internal Harness Connector
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- the internal board connector is silked as **`CN1`**
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- it is an **8-pin connector**
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- the visible wire colors at this connector appear to be:
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- red
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- brown
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- white
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- orange
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- yellow
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- gray
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- blue
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- black
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- this reinforces the earlier point that the internal harness color order does
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**not** match the earlier external cable-color assumptions
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Useful implication:
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- `CN1` is now the strongest candidate for the board-side harness/IO connector
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that should be traced against the external 10-pin cable assembly
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### H8 / DIP Area
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- the H8 marking is now clearly readable in-package as:
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- `H8/536`
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- `HD`
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- `6435368F16`
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- `W34 JAPAN`
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- the DIP switches `S2` and `S3` are clearly visible above the H8
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- the switches show an `ON` legend on one side, which will help keep bit
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numbering consistent during testing
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- the pin-number silkscreen around the H8 is clearly printed, which supports
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the earlier observation that the DIP banks land in the `43-50` region
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### Likely `S1` Footprint
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- one photo shows an **unpopulated circular-pad footprint** labeled `S1`
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- this is important because it suggests:
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- `S1` was not "missing from our search" by accident
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- it may be an intentionally unpopulated switch or selector position on this
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board revision
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- Sony may have designed this PCB for multiple variants/options
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This makes the earlier "no visible `S1`" mystery much less mysterious.
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### Board / Assembly Markings
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- one photo shows a boxed marking:
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- `A-8315`
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- `-095-A`
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- there is also a small sticker:
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- `2A1`
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Working interpretation:
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- `A-8315-095-A` is very likely a Sony board or assembly identifier
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- `2A1` may be an inspection, revision, or production tracking sticker
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### Additional Logic / Glue Area
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- one of the smaller TI chips in the photo area is marked `HC74A`
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- this is consistent with ordinary glue logic / state / timing support around
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the CPU rather than with a second major processor
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- nearby resistor-network and option-footprint areas also fit the picture of a
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configurable CPU/control board with variant population options
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## Additional Silkscreen / Board Markings
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Observed so far:
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- possible connector / reference markings:
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- `RV1`
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- `CNI12`
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- near the `H8/536`:
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- `CNI50`
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- DIP switches:
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- `S2`
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- `S3`
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- board label:
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- `EP-(GW+GN)`
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- large board text:
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- `CPU-345`
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- board appears visually split into quadrants
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- the main custom Sony chip appears to sit in:
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- `B-2`
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## Initial Interpretation
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These are working interpretations, not yet final identifications.
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- `27C512 RCPTX7 V1.05 SONY98`
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- very likely the panel firmware EPROM
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- the `V1.05` label strongly suggests a firmware revision
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- the socketed mounting is very useful for restoration and dumping
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- `H8/536 HD`
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- likely the main microcontroller or one of the main controllers
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- especially likely given that the DIP switches reportedly connect to it
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- the full observed marking is consistent with a Hitachi `HD6435368F`
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H8-family MCU
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- `X20C05`
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- likely nonvolatile storage for configuration / calibration / retained setup
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- `LC3564BM-10`
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- likely RAM or working memory associated with the controller/firmware
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- TI `HC595A`-style parts on the front board
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- consistent with lamp, display, or scanned front-panel I/O expansion
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Additional interpretation from the newer markings:
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- `0047K` on the EPROM may be:
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- an internal Sony build/program label
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- a batch/date/option code
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- or a board/personality identifier tied to this firmware image
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- `CPU-345` strongly suggests this board is treated by Sony as a CPU/control
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board assembly rather than only an interface board
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- `B-2` may be a board-coordinate locator, which could help if a service manual
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or board overlay ever turns up
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- `CNI12` and `CNI50` both look more like connector/reference designators than
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component values
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- `RV1` is ambiguous:
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- often that would imply a variable resistor / trim pot
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- but if the silkscreen is hard to read, it is worth re-checking because it
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may instead be another connector or reference prefix
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- the `H8/536` line-by-line marking strongly suggests the main CPU is not a
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Sony custom controller but a member of the Hitachi H8 family, with Sony
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firmware and surrounding glue logic providing the product-specific behavior
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- the `16` suffix likely indicates a speed grade / variant marker rather than a
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board reference
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- the `JAPAN` marking fits an original Japanese-manufactured MCU package
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## Cross-Equipment Clue
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- The RM-M7G reportedly contains a chip with the same target-like logo and
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`JAPAN` marking from the same apparent manufacturer family.
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Why this matters:
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- the RCP-TX7 and RM-M7G may share a similar controller platform philosophy
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- they may use related H8-family firmware architecture even if the surrounding
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hardware and protocol behavior differ
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- this strengthens the idea that DIP-config, ROM content, and NVRAM content may
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matter as much as the raw serial traffic itself
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## DIP Switches
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- There are **two 4-position DIP switches**
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- All switches are currently **off**
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- One side of each DIP bank appears tied together
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- They appear to act as **ground sinks / pull-to-ground configuration inputs**
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- They reportedly connect to the `H8/536`
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- The DIP switch reference designators are:
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- `S2`
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- `S3`
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- Based on the silkscreen tracing, the DIP switches connect to
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**pins 43 through 50**
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This makes them likely candidates for:
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- panel address / ID selection
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- mode or personality selection
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- service / factory configuration
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- communication mode selection
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Notable oddity:
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- no obvious `S1` has been found yet
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That could mean:
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- `S1` exists on another board
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- `S1` is an unpopulated option on this revision
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- `S1` is present but hidden/obscured
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- Sony numbering simply did not start at `S1` on this assembly
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Why the `43-50` range matters:
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- eight switch positions feeding a contiguous pin range is exactly what you
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would expect for a boot-time configuration byte or bitfield
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- that makes `S2` + `S3` look less like analog trims and more like true digital
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mode/config inputs
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- if those really are `H8/536` pins, they may be read very early at reset or
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power-up
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Current best interpretation of the DIP banks:
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- together they likely form an **8-bit configuration field**
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- likely uses pull-ups or default highs on the MCU side
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- each switch probably pulls its line low when turned on
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- possible meanings still include:
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- panel address
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- model/personality select
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- PT mode / CCU compatibility mode
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- service / factory behavior bits
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- test/diagnostic mode
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## Missing / Unpopulated Components
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- Several components look **intentionally unpopulated**
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For now, assume these may be:
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- factory options
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- alternate hardware revisions
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- model-variant population differences
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- unused test or expansion circuitry
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They should not be treated as damaged/missing until compared against:
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- both PCB sides
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- silk labels
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- any service-manual board drawing
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- other RCP-TX7 board photos, if found later
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The newer photos strengthen this:
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- `S1` now appears to be an intentionally unpopulated footprint
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- there are at least two additional unpopulated IC footprints in the same area
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- this board very likely supported multiple build options or derivatives
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## Why This Matters
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This hardware picture is encouraging because it suggests the RCP is not just a
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"dumb front panel."
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It likely contains:
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- a real MCU (`H8/536`)
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- local firmware (`27C512`)
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- nonvolatile memory (`X20C05`)
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- a front-panel scan / display subsystem
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That means the panel may have:
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- multiple boot/configuration modes
|
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- stored setup or address data
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- more internal state than the serial experiments alone reveal
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It also makes a **firmware dump** or **DIP-switch mapping** potentially very
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high-value later.
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## Next Hardware Inspection Targets
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Highest-value things to map next:
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1. Exact full part markings on the `H8/536` package
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2. Exact full part markings on the `LC3564BM-10`
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3. Exact full part markings on each smaller TI logic IC near the I/O connector
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4. Continuity from the external 10-pin pins to the main-board connector pins
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- especially through `CN1`
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5. Continuity from the serial pins (`4`, `7`, `9`, `10`) to their destination
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chips/components
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6. Whether any of the remaining wires land on:
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- MCU GPIO
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- analog conditioning
|
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- optocouplers
|
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- comparator/op-amp circuitry
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- transceiver/interface ICs
|
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7. Silk labels near the two DIP switch blocks
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- including the exact orientation of the `ON` legend on `S2` and `S3`
|
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8. Any test pads labeled for:
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- `TX`
|
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- `RX`
|
||||
- `CLK`
|
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- `DATA`
|
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- `RST`
|
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- `ROM`
|
||||
- `RAM`
|
||||
- `GND`
|
||||
- `+5V`
|
||||
- `+12V`
|
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|
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## Strong Next Leads
|
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|
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Based on the current findings, the best hardware-side leads are:
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|
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1. **Map the DIP switches**
|
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- note silk labels
|
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- test whether any switch changes startup behavior or serial responses
|
||||
- specifically record the current `S2` / `S3` bit positions before touching
|
||||
- if possible, determine whether the switches are read only at boot or also
|
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during runtime
|
||||
2. **Dump or at least photograph the EPROM label and socket area clearly**
|
||||
- the socketed `27C512` is one of the most promising restoration clues
|
||||
- include the `0047K` marking in the photo record
|
||||
3. **Trace the 8-pin internal connector**
|
||||
- identify which of those lines are serial, power, and "something else"
|
||||
4. **Identify whether the 10-pin path includes a dedicated interface chip**
|
||||
- if not, the extra lines may go directly into the MCU or surrounding logic
|
||||
5. **Verify the likely connector references**
|
||||
- confirm whether `CNI12` is the 8-pin internal cable header
|
||||
- confirm whether `CNI50` refers to the H8 area, a nearby header, or another
|
||||
assembly reference
|
||||
- note that `CN1` is now the strongest observed silk for the internal
|
||||
8-pin harness connector in the photos
|
||||
6. **Compare the RM-M7G controller board if possible**
|
||||
- look for the exact MCU family/part
|
||||
- compare ROM / EEPROM / switch architecture
|
||||
- note whether Sony reused the same CPU platform with different front-end
|
||||
logic
|
||||
|
||||
## Open Questions
|
||||
|
||||
- Is the `H8/536` definitely the primary CPU, or is there another Sony custom
|
||||
controller sharing that role?
|
||||
- Is the socketed `27C512` the only firmware store?
|
||||
- What exactly is stored in the `X20C05`?
|
||||
- Do the DIP switches select mode, address, or board variant?
|
||||
- Do `S2`/`S3` form a single boot configuration byte across MCU pins `43-50`?
|
||||
- Do any of the non-serial wires carry required wake/session information?
|
||||
- Is there a hardware reason the panel never fully leaves `CONNECT NOT ACT`
|
||||
under our emulated PT2 traffic?
|
||||
- What do `CPU-345`, `EP-(GW+GN)`, `CNI12`, and `CNI50` correspond to in Sony's
|
||||
internal board naming?
|
||||
- Is `A-8315-095-A` the specific board assembly number for this CPU board?
|
||||
- Does the RM-M7G use the same H8-family controller and a similar ROM/NVRAM
|
||||
arrangement?
|
||||
|
||||
## DIP Switch Experiment Ladder
|
||||
|
||||
Current known baseline:
|
||||
|
||||
- all 8 DIP positions are currently **off**
|
||||
- switches are grouped as:
|
||||
- `S2` = 4 positions
|
||||
- `S3` = 4 positions
|
||||
- together they likely feed MCU pins `43-50`
|
||||
|
||||
### Safety / Method
|
||||
|
||||
Use this method for every DIP test:
|
||||
|
||||
1. Photograph the current DIP positions before changing anything.
|
||||
2. Change **one switch only**.
|
||||
3. Reassemble only as much as needed for safe power-on.
|
||||
4. Power up the panel.
|
||||
5. Observe behavior **before connecting serial**.
|
||||
6. Then run the normal serial baseline checks.
|
||||
7. Power down fully before changing the next switch.
|
||||
8. Return to the all-off baseline between non-adjacent tests.
|
||||
|
||||
Recommended observations for each run:
|
||||
|
||||
- LCD startup text
|
||||
- whether the active light changes
|
||||
- whether `CONNECT NOT ACT` appears, and when
|
||||
- whether the idle heartbeat is still `00 00 00 00 80 DA`
|
||||
- whether known probes still behave the same:
|
||||
- `A0`
|
||||
- `90`
|
||||
- `AF`
|
||||
- `E8`
|
||||
- `EC`
|
||||
- any new button behavior in idle state
|
||||
- any change in baud-like behavior or complete silence
|
||||
|
||||
### Naming Convention
|
||||
|
||||
Use a simple notation in notes/logs:
|
||||
|
||||
- baseline = `S2=0000 S3=0000`
|
||||
- example single change:
|
||||
- `S2=1000 S3=0000`
|
||||
- meaning only the first `S2` switch is changed from baseline
|
||||
|
||||
If the physical switch numbering is unclear, first label them visually as:
|
||||
|
||||
- `S2-1` .. `S2-4`
|
||||
- `S3-1` .. `S3-4`
|
||||
|
||||
based on one fixed left-to-right or top-to-bottom convention, and stick to it.
|
||||
|
||||
### Phase 1: Single-Bit Sweep
|
||||
|
||||
Goal:
|
||||
|
||||
- find out whether any single DIP bit has an obvious effect on startup,
|
||||
protocol, or front-panel behavior
|
||||
|
||||
Run these eight tests, always starting from all-off baseline:
|
||||
|
||||
1. `S2-1` on, all others off
|
||||
2. `S2-2` on, all others off
|
||||
3. `S2-3` on, all others off
|
||||
4. `S2-4` on, all others off
|
||||
5. `S3-1` on, all others off
|
||||
6. `S3-2` on, all others off
|
||||
7. `S3-3` on, all others off
|
||||
8. `S3-4` on, all others off
|
||||
|
||||
For each test:
|
||||
|
||||
- power-cycle
|
||||
- watch LCD/startup state
|
||||
- check for idle heartbeat
|
||||
- try one minimal probe set:
|
||||
- idle listen
|
||||
- `A0`
|
||||
- `A0 -> 90`
|
||||
- `A0 -> AF`
|
||||
|
||||
What would count as a hit:
|
||||
|
||||
- panel boots into a different visible mode
|
||||
- panel no longer shows `CONNECT NOT ACT`
|
||||
- heartbeat changes or disappears
|
||||
- known startup families change:
|
||||
- `64 40 30`
|
||||
- `0D 04 AB`
|
||||
- `0D 04 EB`
|
||||
- `E4 40 30`
|
||||
- buttons become active in idle
|
||||
|
||||
### Phase 2: Group Identity Test
|
||||
|
||||
Only do this after Phase 1.
|
||||
|
||||
Goal:
|
||||
|
||||
- see whether one whole DIP bank behaves like an address nibble or mode nibble
|
||||
|
||||
Run these four tests:
|
||||
|
||||
1. all `S2` on, `S3` all off
|
||||
2. all `S2` off, all `S3` on
|
||||
3. all `S2` on, all `S3` on
|
||||
4. return to all off baseline and confirm behavior is restored
|
||||
|
||||
What this can reveal:
|
||||
|
||||
- one bank may control personality while the other controls address
|
||||
- one bank may do nothing while the other changes the panel sharply
|
||||
- all-on may expose service/test behavior that single-bit changes do not
|
||||
|
||||
### Phase 3: Follow-Up Only If A Bit Matters
|
||||
|
||||
If Phase 1 reveals a promising bit, branch carefully:
|
||||
|
||||
1. repeat that same switch setting twice to confirm reproducibility
|
||||
2. test neighboring bits in the same bank
|
||||
3. test that bit plus one neighboring bit
|
||||
4. compare:
|
||||
- startup text
|
||||
- heartbeat
|
||||
- `A0 -> 90`
|
||||
- `A0 -> AF`
|
||||
- `E8` / `EC` selector behavior
|
||||
|
||||
### Good First Serial Checks Per DIP Setting
|
||||
|
||||
Keep the serial side small at first.
|
||||
|
||||
Recommended order:
|
||||
|
||||
1. idle listen only
|
||||
2. repeating heartbeat only
|
||||
3. `A0`
|
||||
4. `A0 -> 90`
|
||||
5. `A0 -> AF`
|
||||
|
||||
Only if something changes meaningfully, then test:
|
||||
|
||||
- `E8`
|
||||
- `E9`
|
||||
- `EC`
|
||||
- CALL synthetic trigger
|
||||
|
||||
### Strong Cautions
|
||||
|
||||
- Do not change multiple unknown DIP bits at once in the first pass.
|
||||
- Do not assume "on" means logic high; it may actually pull the line low.
|
||||
- Some switches may only be sampled at cold boot, not warm reset.
|
||||
- A strange setting may stop normal serial output entirely; that is still a
|
||||
useful result.
|
||||
- If one setting produces a dramatically different boot state, stop and record
|
||||
it before going wider.
|
||||
Reference in New Issue
Block a user